FP-GPIO96 FeaturePak Digital I/O Module
Programmable Digital I/O FeaturePak Module with Customizable Personality
(click to enlarge)
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Description |
FP-GPIO96 is a general purpose I/O FeaturePak module using a high-capacity (700K gate equivalent) PCI Express FPGA
for maximum density and flexibility. The base hardware configuration features 96 digital I/O lines grouped into 12
8-bit ports. All ports have I/O buffers to protect the FPGA and feature 5V logic drive levels.
The ports are organized into a combination of byte-wide, nibble-wide, and bit-wide direction control for maximum
flexibility and application compatibility.
The built-in FPGA personality provides multiple configuration options. All 96 I/O lines may be used in common I/O mode;
Six of these ports can be reconfigured to enable an array of additional features, including 8 32-bit up/down
counter/timers with programmable input source and gate, 4 24-bit PWM circuits with 0-100% duty cycle capability and
interrupt/latched mode operation.
The flash-based design enables easy field upgrades using a Diamond-provided software utility (no cable or third-party
software required!) as well as custom code development. Universal Driver software support (described below) is included
for Linux, Windows XP, Windows Embedded CE/Standard.
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Block Diagram |
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Universal Driver Software |
Diamond's exclusive Universal Driver Software is included at no
charge along with the FP-GPIO96 I/O module. It provides a high-level
programming library for all of our I/O boards, as well as for the data
acquisition circuitry on our SBCs and Embedded-Ready Subsystems. All
data acquisition features are supported by easy-to-use function calls,
resulting in a reduced learning curve and shortened application
development time. The Universal Driver works with Linux and Windows XP.
Application examples and projects are included for each function, each
board, and each operating system, in order to provide a quick starting
point for learning and development. Learn more about our Universal
Driver software here.
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About the FeaturePak embedded I/O standard |
FeaturePak dimensions
(click to enlarge) |
The FeaturePak™
Trade Association, originated by Diamond Systems, was launched at the Embedded World tradeshow in March, 2010.
The FeaturePak Specification defines a highly-compact, low-profile, and inexpensive way to add configurable
I/O functions to embedded systems. The tiny FeaturePak modules -- measuring just 1.70 x 2.55 inches (see
photo at right) -- can be used for providing snap-in options or upgrades for off-the-shelf single board
computers (SBCs) and computer-on-module (COM) baseboards, or as building blocks to simplify the development
of fully-custom embedded electronics. Additionally, FeaturePak modules provide "zero height expansion," in that they
fit within the normal component envelope of an SBC or COM baseboard and add no height to PC/104-style I/O expansion
stacks. Learn more about the FeaturePak embedded I/O expansion standard here.
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Specifications |
| Base FPGA |
LatticeECP3, 700K gate equivalents |
| Input clock |
50MHz |
| FPGA code storage |
Flash memory, field upgradeable via JTAG |
| Total I/O lines on FeaturePak connector |
96 |
| Primary I/O |
48 lines with 3 8-bit and 2 4-bit; configurable pull-up/down resistors |
| Secondary I/O |
48 lines with 6 8-bit buffers; configurable pull-up/down resistors |
| Counter/timers |
8 32-bit up/down counters (alternate mode) |
| Max counting frequency |
(coming soon) |
| Counter modes |
Counter, rate/square-wave generator, pulse-width modulator, programmable one-shot, hardware/software triggered strobe |
| Output current |
Ports A, B & D: 24mA per pin max; 200mA per port max
Port C low: 24mA per pin max
Port C high: -24mA per pin max
Ports E & F: 32mA per pin max |
| Input current |
+/-340uA max |
| FeaturePak |
Compliant, zero height expansion |
| Dimensions |
1.70 x 2.55 in. (43 x 65 mm); FeaturePak form-factor |
| Power supply |
3.3VDC ±5% |
| Operating temperature |
-40°C to +85°C standard |
| Weight |
0.5 oz (14 g) |
| RoHS |
Compliant |
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