| Step |
Description |
| Specification |
Finalize requirements specification. Define the performance requirements, memory requirements, environmental and regulatory requirements, bus expansion (if necessary), power requirements, form factor, connector types and locations, and I/O requirements. Select I/O blocks from existing Diamond Systems I/O function library. |
| COM CPU Selection |
Evaluate and select COM module(s). Choose an individual module or a family of modules to meet the performance and environmental requirements of the application. Choose from ETX, XTX or COMexpress CPU modules. |
| Proof of Concept |
Preliminary parts placement for verification of project goals.Given the chip count and approximate board space requirements of the Diamond Systems I/O library elements, determine the required board space and approximate placement of key components, including the ETX module itself. |
| Schematic Design |
Complete the schematic of the custom baseboard using schematic elements from the Diamond Systems I/O function library as well as customer-supplied designs and new designs. |
| Design Review |
Review the design and update the specification as needed. |
| PCB Layout and Material Planning |
Complete the layout and routing of the custom baseboard. Finalize the bill of materials and approved vendor list. (Activities occur in parallel.) |
| Layout Review |
Review the final board layout, including all connector types and locations. |
| Prototype Development |
Fabricate the PCB, purchase all components, assemble prototypes, and bring up design. |
| Design Verification |
Conduct extensive testing of design, including environmental test, stress test, and agency approvals. |
| Qualification |
Customer evaluation and qualification of the prototypes for appropriate performance and fit. |
| Product Release |
ECO release of design files to manufacturing, including customer and Diamond Systems signoff of project. |
| Production |
Mass production of the final approved design. Diamond Systems can deliver the baseboard alone or as a tested subassembly with the COM CPU installed. |
