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Conduction Cooling for Stackable SBCs

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EmbeddedXpress Form Factor

Application Articles

Building Automation
Paper Processing
Train Controller
Wind Instrument
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Level 1 Integration: Hardware Core

The Hardware Core sub-assembly integration begins with development of a requirements document that defines the system in detail. Diamond's integration team forms a baseline solution using off-the-shelf products from Diamond Systems as well as our third party partners. We then take into consideration any design needs for ruggedization or customization of these standard board-level products. We validate the core hardware to ensure compatibility and performance. The hardware core is assembled and functionally tested using our standard acceptance tests or customer-supplied software.

Level 1 Example

Industrial: Remote Data Collection System

This application involved the collection of vibration data on bridges using a solar-powered system with battery backup. The boards were assembled into a custom enclosure. The low-power system runs Linux from a solid state flashdisk mounted on the Prometheus CPU

Integration Quicklinks
Level 1: Hardware Core Sub-Assemblies
Level 2: System Level Assemblies
Level 3: OEM Ready Solutions
System Components:

Prometheus CPU board with integrated data acquisition
HESC-104 DC/DC power supply with smart charger
BAT104 backup battery