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Level 3 Integration: OEM Ready Solutions

As opposed to a "one size fits all" approach to systems integration, the OEM Ready Solutions program offers rapid development of custom system solutions and services that meet each customer's unique needs. The program provides complete turnkey solutions -- from concept to volume manufacturing -- enabling Diamond to act as an extension of your development team for collaborative product development efforts.

Level 3 Example

Industrial: Oil Exploration

A company involved in oil exploration in remote locations around the world had a need for a harsh-environment-capable embedded system for data collection. Their requirements for rugged performance and analog I/O made Diamond Systems a natural choice. We were further able to meet their special requirements in the data collection process through modification of our standard A/D board with custom logic. Finally, their need for rapid deployment, combined with limited in-house engineering resources, caused them to turn to Diamond for a total solution. This combination of rugged design, customization, and integration services made the Diamond OEM Ready Solutions program a perfect fit for this customer's needs.

Integration Quicklinks
Level 1: Hardware Core Sub-Assemblies
Level 2: System Level Assemblies
Level 3: OEM Ready Solutions
System Components:
  Athena 400MHz fanless CPU board
  Diamond-MM-32X Analog I/O board (customized)
  Jupiter-MM DC/DC power supply
  Hitachi ruggedized notebook hard drive
  Pandora system enclosure