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Whitepapers

Conduction Cooling for Stackable SBCs

COM-based SBC Benefits

Benefits of Autocalibration

EmbeddedXpress Form Factor

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Building Automation
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Rugged Embedded Products

Diamond's products are designed from the ground up to meet the challenges of harsh and hostile environments. These include the extreme cold found in airborne systems, extreme heat in desert locations, or the vibration found in a diesel locomotive.

In support of performance-critical embedded requirements, our products are designed to operate reliably over extended temperature ranges and at high levels of shock and vibration. This includes our complete line of small form factor SBCs, wide variey of I/O modules, and our rugged box systems.

Designed In Ruggedness

The following rugged features are already standard attributes of Diamond Systems' products.
Click here for information on custom ruggedization services.

2-in-1 SBCs
2-in-1 SBCs combine the core computing capabilities of a typical embedded single board computer with a complete analog and digital data acquisition sub-system, resulting in a thinner, lighter, more rugged, and easier to assemble embedded computing platform.
Athena III 2-in-1 SBC 2-in-1 SBCs are an ideal choice for embedded applications, including portable, in-vehicle & outdoor systems
Extended Temperature Operation
Virtually all of our embedded boards are rated for extended temperature operation of -40C to +85C. Our designs withstand the inevitable temperature-related variation in component specifications, while still delivering rated performance. All our products are fully tested and guaranteed for proper performance over their entire rated operating temperature.
Extended Temperature Testing Extended temperature operation is tested and guaranteed
Soldered-on Memory
Most of our SBCs feature soldered-on memory to improve reliability by preventing memory module popout due to vibration. In addition, soldered-on memory guarantees proper performance over the entire operating temperature range and prevents possible compatibility problems that can occur when memory module suppliers change components or designs.
Soldered-on Memory Soldered-on memory increases ruggedness of our embedded SBCs
Conduction Cooling
Many of our single board computers implement conduction cooled heat spreaders instead of traditional heat sinks. These heat spreaders mate to your enclosure or bulkhead and provide a more efficient means for removing heat from the system; thereby increasing reliability and product life. All of our heat spreaders and heat sinks are secured with screws and threadlock for additional resistant to shock and vibration.
Conduction Cooled SBC Conduction cooling provides more efficient thermal management
Autocalibration
Our analog I/O boards and SBCs with on-board data acquisition feature autocalibration of analog I/O circuitry to ensure maximum measurement accuracy over the complete operating temperature range. Autocalibration provides up to 10 times reduction in measurement error over temperature as compared to competing boards.
Autocalibration for Improved Performance Autocalibration of analog inputs provides 10x error reduction resulting in improved performance
Fan-less Operation
Rotating parts such as fans and hard disks are one of the most common sources of failure in embedded systems. We use no fans on any of our products.
Helios PC/104 SBC Fan-less SBCs with heat sinks or heat spreaders
Solid State Flashdisk Storage
All of our SBCs are designed to work with solid state SLC flashdisks for improved reliability and lighter weight. The board-mounted solid state flashdisk acts just like a standard hard drive, except it has no moving parts. The flashdisk installs directly onto a connector on the SBC and is held in place with a mounting screw to prevent disconnection due to vibration.
Solid State Flashdisk Solid-state flashdisks replace conventional hard drives and provide increased ruggedness & reduced weight
Cable-free Enclosure
Our Pandora enclosure improves reliability by eliminating one of the most common sources of failure - the interconnecting cables. Front panels connect directly to the SBC, eliminating interconnecting cables. Custom front panels can be designed to accommodate customer-specific applications.

SBC with Front Panel Installed Cable-free enclosure system reduces assembly time, eliminates assembly errors, & increases ruggedness
Custom Ruggedization Services

We offer a variety of custom ruggedization services to further enhance our product reliability.
The following special services are available by consultation:

Full extended temperature screening
Burn-in testing
Conformal coating
Hardwired configuration
Connector changes including latching connectors
Testing to shock & vibration specifications
Component staking


Click here for more information on these custom ruggedization services.


pc104 EPIC EBX ETXcom expressfeaturepakEMX

The Diamond Systems logo is a trademark of Diamond Systems Corporation. PC/104, PC/104-Plus, PCIe/104, EPIC, and EBX are trademarks of the PC/104 Embedded Consortium. All other trademarks are the properties of their respective owners.