Single Board Computers

Our extensive line of compact, rugged SBCs is based on CPUs targeting embedded applications, ranging from the economical AMD LX800 and Vortex86DX to the high performance Intel Core i7 latest generation U series Skylake/Kaby Lake. These products adhere to industry-standard form factors such as PC/104, COM Express, ETX, EPIC, and EBX.

Our SBCs are designed with 2 key criteria in mind: ruggedness and I/O. On average a DSC SBC will provide more I/O and greater ability to withstand harsh environments than other SBCs of the same size, CPU class, and price category.

2-in-1 Design

Most of our SBCs are 2-in-1 products. These boards incorporate a complete professional-quality data acquisition subsystem onto the board. By eliminating an add-on board required with other SBCs, this integration significantly reduces the size and weight of a system requiring analog I/O and can also to provide significant cost savings. Diamond pioneered this concept and still leads the industry in its implementation.

Conduction Cooling

Most of our newer SBCs utilize superior conduction cooling for thermal management. Instead of the traditional heat sink which inefficiently transmits heat to low-mass air trapped inside the box, a conduction-cooled SBC utilizes a flat plate with a large surface area to transmit the heat directly to the much higher mass enclosure wall. Conduction cooling significantly reduces the temperature gradient between the CPU die and the exterior environment, leading to higher safety margins and higher reliability in high ambient temperature conditions. Diamond was an early adopter of conduction cooling in small form factor SBCs and today offers the widest range of these products.

PC/104 Athena III PC/104 SBC PC/104 single board computer with 1.6GHz or 1GHz Intel Atom E-Series CPU and Integrated Autocalibrating Data Acquisition Helios PC/104 SBC PC/104 SBC with 800MHz Vortex86 CPU and Integrated Autocalibrating Data Acquisition Helix PC/104 SBC PC/104 SBC with 1GHz Vortex86DX3 CPU and on-board data acquisition Rhodeus PC/104 SBC Low-Cost, Low-Power AMD Geode LX800 PC/104 SBC with CRT/LCD, LAN and CompactFlash PC/104-Plus Aries PC/104-Plus SBC PC/104-Plus SBC with Intel E3800 CPU, On-Board Data Acquisition & PCIe MiniCard I/O Expansion 3.5 Inch Venus 3.5 Inch Core i7/i5 SBC Rugged SBC with Intel Skylake or Kaby Lake 6th Gen Core Processor EBX Hercules III SBC EBX SBC with 1.6GHz Intel Atom E680T CPU, Integrated Autocalibrating Data Acquisition, and DC/DC Power Supply

3.5 Inch Eagle ARM SBC 3.5 inch ARM SBC using Toradex Apalis modules Eagle Baseboard 3.5 inch baseboard for Toradex Apalis ARM COMs Compact 4x4 Eaglet ARM SBC Compact ARM SBC using Toradex Apalis ARM modules Eaglet Baseboard Compact baseboard for Toradex Apalis ARM COMs EPIC Neptune EPIC SBC EPIC SBC with Intel E3845 or AMD Fusion G-T56N/G-T40N CPU, integrated autocalibrating data acquisition, DC/DC power supply, and configurable ETX CPU COM Express Zeta Miniature COM-Based SBC Ultra-Small Solution with Integrated DAQ using COM Express Mini CPU Modules ETX Pluto ETX SBC ETX SBC with Intel E3845, AMD Fusion G-T56N or G-T40N CPU, PC/104-Plus expansion and configurable ETX CPU

COM-based Single Board Computers

Diamond was one of the first companies to introduce the concept of a COM-based SBC. This 2-board solution combines an industry-standard off-the-shelf COM (computer on module) such as COM Express or ETX with a baseboard that provides the final inch of all the I/O and power needed to create a complete SBC product. The advantages of a COM-based SBC are numerous and are especially attractive to customers with long lifecycle requirements:

• Off-the-shelf solution – fast time to market, reduced development cost
• Scalable CPU performance
• Earlier access to the newest CPU technologies than with a standard SBC
• Long lifetime due to the ability to swap out an end of life COM with a next generation model
• Highest feature density per unit area due to the stacked design
• Single-vendor solution
• Reduced purchasing and inventory

The COM-based SBC consists of 3 “layers”:

The bottom layer is the efficient conduction cooling heat spreader, which also serves as the mounting mechanism for the SBC.

The middle layer is the COM, providing the complete core CPU functionality in an industry-standard form factor.

The top layer is the baseboard or “application layer”. This board contains all the I/O connectors, power supplies, and other circuitry to turn the COM into a complete embedded computer.