3.5" Form Factor

PC/104

PC/104-Plus

PCIe/104

PCI/104-Express

COM Express

Single Board Computers

I/O Modules

Power Supplies

Single Board Computers

I/O Modules

Power Supplies

I/O Modules

Single Board Computers

Rugged Computers

Rugged Ethernet Switches

Cables

PC/104

Adapters

PC/104

PC/104-Plus

PCIe MiniCard

PC/104

PCIe MiniCard

PC/104

PC/104-Plus

PCI/104-Express

PCIe MiniCard

PC/104-Plus

PCIe MiniCard

PC/104-Plus

PCIe MiniCard

I/O Modules

Single Board Computers

I/O Modules

PC/104

PC/104-Plus

PC/104

Small form factor

Ethernet Switch Modules

Single Board Computers

Ethernet Switches

AGX Orin Solutions

ORIN Nano / NX

Nano and NX Solutions

AGX Xavier Module Solutions


OEM READY SOLUTIONS PARTNER PROGRAM

Diamond Systems has partnered with Suntron Corporation in order to extend our integration services offering. Suntron has become a certified Diamond Partner of the "OEM Ready Solutions" program. This partnership enhances our capability of offering customers vertical integration of complex electronic product and system level designs, including single board computers, analog & digital I/O hardware, software, mechanical design, and analytical solutions.

OEM Ready Integration Services Suite

DESIGN

System level configuration and design (including customization of standard board-level products or full-custom design)
Design for Ruggedization
Customization
Design for Optimization
Design for high degree of functional integration
Hardware design in digital, analog, RF, FPGA, CPLD, microcontroller, microprocessor, network processor, and power electronics technologies

VALIDATION

Development and implementation of in-circuit test, functional verification test, HASS, HALT, ESS, burn-in, test software, and on-going reliability testing
Verification of EMI, RFI, temperature, humidity, and vibration for agency certification
Screen for agency compliance for CE, FCC, UL, and NEBS

NEW PRODUCT INTRODUCTION

Creation of Production Build Packages
Creation of test plans and fixtures

MANUFACTURING

Quick turn prototyping and high mix production
Procurement and integration of all third party hardware and software
Integration and management of customer supplied software and hardware
Configuration control
Test and Measurement through ICT and functional test development
Extended Temperature Screening

LOGISTICS

Inventory planning
Scheduled shipments to end customer
Warranty repair and service

LIFE CYCLE MANAGEMENT

Component EOL Notice
Component Bonding
Technology Refreshes
Next Generation Migration

Integration Quicklinks
Level 1: Hardware Core Sub-Assemblies
Level 2: System Level Assemblies
Level 3: OEM Ready Solutions